Title:
SHEET FOR PROCESSING SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JP2000234079
Kind Code:
A
Abstract:
To provide a sheet for processing semiconductor wafer with high initial adhesion and excellent in stripping workability after use and having an adhesive layer which does not stain the surface of the semiconductor after stripping.
A sheet for processing semiconductor wafer has an adhesive layer on one side of the substrate film. The adhesive layer comprises a pressure- sensitive adhesive and an adhesive composition containing 1-30 wt.% of a side chain crystallizable polymer, wherein the polymer contains an acrylate and/or a methacrylate having a linear alkyl group with 16 or more carbon atoms as a side chain and the composition has an adhesive strength on stainless steel at 23°C of 200 g/25 mm or more.
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Inventors:
ANDO TAKUJI
INOUE EIJI
NAGAI KIYOTAKA
INOUE EIJI
NAGAI KIYOTAKA
Application Number:
JP3652099A
Publication Date:
August 29, 2000
Filing Date:
February 15, 1999
Export Citation:
Assignee:
NITTA KK
International Classes:
H01L21/301; C09J7/02; C09J133/06; (IPC1-7): C09J7/02; C09J133/06; H01L21/301
Attorney, Agent or Firm:
Shusaku Yamamoto
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