Title:
RESIN COMPOSITION FOR ELECTRONIC MEMBER
Document Type and Number:
Japanese Patent JP2668511
Kind Code:
B2
Abstract:
PURPOSE: To provide the title compsn. which has a low relative permittivity, a low dissipation factor, a high heat resistance, high mechanical strengths. and a good thermal conductivity and is suitable for a circuit board material of an electronic apparatus.
CONSTITUTION: The compsn. contains a matrix resin comprising a polyetherimide, a polyphenylene ether, and an arom. vinyl resin and a whisker represented by the general formula: aAxOy.bB2O3 (1≤a≤9; 1≤b≤9; A is a di- or trivalent element; and x=y=1, or x=2 and y=3) in an amt. of the whisker of 5-60wt.% based on the sum of the matrix resin and the whisker.
Inventors:
Hiroyuki Kade
Takio Tasaka
Watanabe Ikue Ikue
Kimura Takao
Takio Tasaka
Watanabe Ikue Ikue
Kimura Takao
Application Number:
JP22731194A
Publication Date:
October 27, 1997
Filing Date:
August 29, 1994
Export Citation:
Assignee:
Otsuka Chemical Co., Ltd.
Cosmo Research Institute Co., Ltd.
Cosmo Research Institute Co., Ltd.
International Classes:
C01B35/10; C08K7/00; C08K7/08; C08L25/04; C08L71/12; C08L73/00; C08L79/08; H01B3/00; H05K1/03; (IPC1-7): C08L79/08; C01B35/10; C08K7/08; C08L25/04; C08L71/12; H01B3/00
Domestic Patent References:
| JP5179140A | ||||
| JP4153264A | ||||
| JP532880A | ||||
| JP6220249A | ||||
| JP3502107A |
Attorney, Agent or Firm:
Kubota Chikashi (1 person outside)