Title:
RESIN COMPOSITION AND EXTRUSION-MOLDED BODY
Document Type and Number:
Japanese Patent JP2022087992
Kind Code:
A
Abstract:
To provide a resin composition in which the occurrence of void and whitening is suppressed and a b value is low, and to provide an extrusion-molded body.SOLUTION: A resin composition is an extrusion-molding resin composition that contains a polyacetal resin, in which the area from the start of crystallization to the top of the crystallization peak when the resin composition is isothermally crystallized at 148°C is in a range of 40 to 50% of the area of the whole crystallization peak.SELECTED DRAWING: Figure 1
Inventors:
FUJIMOTO KUNIHIKO
KOBAYASHI DAISUKE
KOBAYASHI DAISUKE
Application Number:
JP2020200179A
Publication Date:
June 14, 2022
Filing Date:
December 02, 2020
Export Citation:
Assignee:
MITSUBISHI ENG PLASTICS CORP
International Classes:
C08L59/00; C08G2/10; C08L23/00; C08L23/04; C08L91/08
Attorney, Agent or Firm:
Patent Service Corporation Patent Office Sykes
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