Title:
RESIN COMPOSITION FOR HOT MELT ADHESIVE, ADHESIVE FOR GLASS OR ORGANIC GLASS, AND LAMINATE
Document Type and Number:
Japanese Patent JP2019073650
Kind Code:
A
Abstract:
To provide a resin composition for hot melt adhesive which is excellent in transparency, appearance and adhesion to glass and organic glass and is also excellent in durability and an adhesive for glass and a film for laminated glass intermediate film formed from the same, and a laminate with glass and laminated glass using the same.SOLUTION: A resin composition for hot melt adhesive, which contains 0.5 to 10 pts.wt. of a low-molecular compound (B) having a refractive index of 1.480 to 1.600 and a solubility parameter calculated by Fedors method of 8.5 to 10.1 and 5 to 30 pts.wt. of a hydrogenated hydrocarbon resin (C) based on 100 pts.mass of an ethylene-vinyl acetate copolymer saponification product (A) having a vinyl acetate content ratio of 5 to 50 wt.%, a vinyl alcohol content ratio of 0.8 to 10 wt.% and a melt mass flow rate of 0.1 to 100 g/10 min, is used as an adhesive for glass and/or organic glass.SELECTED DRAWING: None
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Inventors:
OTAKE MASATO
KODA SHINGO
KODA SHINGO
Application Number:
JP2017201836A
Publication Date:
May 16, 2019
Filing Date:
October 18, 2017
Export Citation:
Assignee:
TOSOH CORP
International Classes:
C09J131/04; B32B27/28; C03C27/12; C09J7/00; C09J11/06; C09J11/08; C09J123/04; C09J123/26; C09J129/02
Domestic Patent References:
| JP2003268330A | 2003-09-25 | |||
| JPH03109241A | 1991-05-09 |