Title:
RESIN COMPOSITION AND INSULATED WIRE
Document Type and Number:
Japanese Patent JPH08176247
Kind Code:
A
Abstract:
PURPOSE: To enable an insulated wire having an insulating layer formed from an ultraviolet-curable urethane acrylate resin to be soldered at a low temp. in a short time.
CONSTITUTION: 100 pts.wt. ultraviolet-curable urethane acrylate resin is compounded with 1-10 pts.wt. inorg. metal compd. (e.g. zinc chloride or iron chloride) or organometallic compd. (e.g. dibutyltin dilaurate, cobalt naphthenate, or iron 2-ethylhexoate), then applied to a conductor 1, and cured by irradiating with ultraviolet ray, thus forming an insulating layer 2.
Inventors:
SUGIYAMA SHUICHI
ONO AKINOBU
KOBAYASHI KAZUHARU
SAWAMOTO TAKEHITO
ONO AKINOBU
KOBAYASHI KAZUHARU
SAWAMOTO TAKEHITO
Application Number:
JP32342194A
Publication Date:
July 09, 1996
Filing Date:
December 26, 1994
Export Citation:
Assignee:
FUJIKURA LTD
International Classes:
C08K3/16; C08F290/00; C08F299/06; C08G18/67; C08K5/09; C08K5/56; C08L75/00; C08L75/16; C09D175/14; C09D175/16; H01B3/30; (IPC1-7): C08F299/06; C08G18/67; C08K3/16; C08K5/09; C08K5/56; C08L75/16; C09D175/16; H01B3/30
Attorney, Agent or Firm:
Masatake Shiga