Title:
RESIN COMPOSITION FOR INSULATING LAYER
Document Type and Number:
Japanese Patent JP2010163521
Kind Code:
A
Abstract:
To provide a resin composition for an insulating layer of an organic thin film transistor, which can be crosslinked without being treated at a high temperature for a long time and is capable of forming an insulating layer excellent in surface adhesion property.
The resin composition for the insulating layer of the organic thin film transistor comprises (A) a polymer compound containing a repeating unit to which a photosensitive group is bound through a urea bond or a urethane bond, (B) a hardener, and (C) an organic solvent. An organic thin film transistor is also provided using the resin composition as an overcoat layer.
COPYRIGHT: (C)2010,JPO&INPIT
Inventors:
YAHAGI AKIRA
Application Number:
JP2009005812A
Publication Date:
July 29, 2010
Filing Date:
January 14, 2009
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO
International Classes:
C08F299/00; C08F8/00
Attorney, Agent or Firm:
Mitsuo Tanaka
Takuji Yamada
Muneo Yamamoto
Masaishi Nishishita
Takuji Yamada
Muneo Yamamoto
Masaishi Nishishita
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