Title:
RESIN COMPOSITION, ITS HARDENED BODY AND PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPH11242332
Kind Code:
A
Abstract:
To obtain an easily developable resin compsn. excellent in solvent resistance, plating soln. resistance and electrical characteristics, also provided with heat resistance that can withstand a temp. in a soldering step and suitable particularly for the production of a printed circuit board.
This resin compsn. contains an epoxy (meth)acrylate resin (A) which is the reaction product of an epoxy resin having at least two epoxy groups in the molecule with an unsatd. group-contg. monocarboxylic acid or a carboxyl, group-contg. epoxy (meth)acrylate resin (A') which is the reaction product of the epoxy (meth)acrylate resin A with a polybasic acid anhydride, an ion capturing agent (B) and a didluent (C).
Inventors:
YOKOSHIMA MINORU
OKUBO TETSUO
SASAHARA KAZUNORI
OKUBO TETSUO
SASAHARA KAZUNORI
Application Number:
JP5738698A
Publication Date:
September 07, 1999
Filing Date:
February 24, 1998
Export Citation:
Assignee:
NIPPON KAYAKU KK
International Classes:
G03F7/004; C08F299/02; G03F7/027; H05K3/18; (IPC1-7): G03F7/027; C08F299/02; G03F7/004; H05K3/18