Title:
樹脂組成物、硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
Document Type and Number:
Japanese Patent JP7091881
Kind Code:
B2
Abstract:
To provide a resin composition which can form a cured product excellent in adhesion with copper after high temperature storage and reflow treatment, after formation of a cured product even in low temperature curing of 200°C or lower, a method for producing a cured product, a cured product, an interlayer insulation film, a cover coat layer, a surface protective film and an electronic component.SOLUTION: A resin composition contains (A) a polyimide precursor, (B) a compound containing a heterocyclic structure containing a nitrogen atom having pka of 8.30-8.80, and (C) 5-amino-1H-tetrazole.SELECTED DRAWING: None
Inventors:
Akira Asada
Atsutarou Yoshizawa
Atsutarou Yoshizawa
Application Number:
JP2018124024A
Publication Date:
June 28, 2022
Filing Date:
June 29, 2018
Export Citation:
Assignee:
hd micro systems inc.
International Classes:
C08L79/08; C08F299/02; C08G73/12; C08K5/3472; G03F7/004; G03F7/038; G03F7/20
Domestic Patent References:
| JP2011169980A | ||||
| JP8286374A | ||||
| JP2008115377A |
Foreign References:
| WO2014097633A1 | ||||
| WO2018021262A1 | ||||
| WO2008059808A1 | ||||
| US20110054124 |
Attorney, Agent or Firm:
Patent Attorney Corporation Peace International Patent Office