Title:
樹脂組成物、硬化物の製造方法、硬化物、カバーコート層、表面保護膜及び電子部品
Document Type and Number:
Japanese Patent JP7451970
Kind Code:
B2
Abstract:
To provide a resin composition that enables formation of a cured product which suppresses discoloration of appearance and improves adhesion, a method for producing a cured product, a cured product, a cover coat layer, a surface protective film, and an electronic component.SOLUTION: A resin composition contains (A) a polyimide precursor having a structural unit represented by the following formula (1), (B) an anti-rust agent, and (C) an antioxidant.SELECTED DRAWING: None
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Inventors:
Atsutarou Yoshizawa
Satoshi Yoneda
Satoshi Yoneda
Application Number:
JP2019216360A
Publication Date:
March 19, 2024
Filing Date:
November 29, 2019
Export Citation:
Assignee:
hd micro systems inc.
International Classes:
C08L79/04; C08G73/10; C08K5/13; C08K5/3445; C08K5/3472; C09D7/63; C09D179/08
Domestic Patent References:
| JP2017194677A | ||||
| JP2007310201A | ||||
| JP2019123864A | ||||
| JP2012141447A |
Foreign References:
| WO2017209177A1 | ||||
| WO2011040441A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Peace International Patent Office
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