Title:
配線基板
Document Type and Number:
Japanese Patent JP7451971
Kind Code:
B2
Abstract:
To provide a wiring board capable of suppressing the generation of a solder bridge.SOLUTION: A wiring board 1 includes: a base material 2 having a first surface 2a and a second surface 2b; a one layer or more of wirings 3a and 3b arranged on the first surface side of the base material; and one layer or more of insulation layers 4a and 4b. The one or more layer of the wiring has at least the outermost wiring 13 located furthest from the base material. The one or more layer of the insulation layer is arranged on a surface side opposite to the surface on the base material side of the outermost wiring, and includes at least the outermost insulation layer 14 having an open part 5b located on the outermost wiring. The wiring board is arranged in the open part of the outermost insulation layer, and further includes a connection part 8 electrically connected to the outermost wiring. The outermost insulation layer includes a convex part 15 on the surface opposite to the surface on the outermost wiring side and a peripheral edge part of the open part, and a height from the first surface of the base material of the convex part of the outermost insulation layer is higher than that from the first surface of the base material of the connection part, and a pitch P of the connection part is 50 μm or less.SELECTED DRAWING: Figure 1
Inventors:
Atsuko Chiyoshi
Yuji Narita
Seiji Tawaraya
Yuji Narita
Seiji Tawaraya
Application Number:
JP2019216996A
Publication Date:
March 19, 2024
Filing Date:
November 29, 2019
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H01L23/12; H01L21/60; H05K3/34; H05K3/46
Domestic Patent References:
| JP2016162770A | ||||
| JP1073696A | ||||
| JP2068474U | ||||
| JP2017118067A | ||||
| JP2016143810A |
Foreign References:
| WO2013171964A1 |
Attorney, Agent or Firm:
Akihiko Yamashita
Tatsuto Kishimoto
Tatsuto Kishimoto