Title:
RESIN COMPOSITION FOR MOISTURE-PROOFING PROCESSING AND MOISTURE-PROOF MATERIAL
Document Type and Number:
Japanese Patent JP2002179926
Kind Code:
A
Abstract:
To provide a resin composition for moisture-proofing processing capable of imparting moisture-proof performances superior to those of a polyethylene-laminated paper, having excellent separability of the resin layer from paper in recycling, excellent in resistance to slipperiness and free from omission of wax, and moisture-proof material.
The resin composition for moisture-proofing processing comprises a synthetic resin emulsion or a synthetic rubber latex (A) and a hydrophobic organic resin powder (B) having an average particle size of 1-50 μm and a softening point of at least 70°C. The moisture-proof material comprises a substrate having this composition coated thereon.
Inventors:
KAKINUMA CHIKAO
KAWASAKI TETSUO
YOSHIKAWA KEIGO
KAWASAKI TETSUO
YOSHIKAWA KEIGO
Application Number:
JP2000380196A
Publication Date:
June 26, 2002
Filing Date:
December 14, 2000
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
B32B27/00; C08K3/00; C08L101/00; D21H19/58; D21H21/14; (IPC1-7): C08L101/00; B32B27/00; C08K3/00; D21H19/58; D21H21/14
Domestic Patent References:
| JP2001026677A | 2001-01-30 | |||
| JPH11263849A | 1999-09-28 | |||
| JPH10226964A | 1998-08-25 | |||
| JPH10292290A | 1998-11-04 | |||
| JP2000220094A | 2000-08-08 | |||
| JPS5658096A | 1981-05-20 | |||
| JP2000345494A | 2000-12-12 | |||
| JP2000087012A | 2000-03-28 | |||
| JP2000313793A | 2000-11-14 |
Attorney, Agent or Firm:
Takahashi victory
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