Title:
RESIN COMPOSITION, MOLDED PRODUCT THEREOF, AND METHOD OF MOLDING THE SAME
Document Type and Number:
Japanese Patent JP3301511
Kind Code:
B2
Abstract:
PURPOSE: To obtain the title composition suppressed in the polymerization of the constituent polyfunctional monomer in air and having excellent thermal properties by mixing a specified polyfunctional monomer with a radical polymerization inhibitor.
CONSTITUTION: A resin composition comprises a normally solid polyfunctional monomer having a vinyl group and a vinylene group and a radical polymerization inhibitor. It may further contain a inorganic filler. The amount of the inhibitor added is desirably 0.01-5mol% based on the polyfunctional monomer. It is desirable that the polyfunctional monomer used be a compound represented by the formula (R is a 6-20C bivalent organic residue having at least one aromatic ring). In curing the monomer, the cure initiation time is arbitrarily controlled by varying the amount of the polymerization inhibitor added.
Inventors:
Satoru Amaha
Shin Nishimura
Akio Takahashi
Shin Nishimura
Akio Takahashi
Application Number:
JP9795294A
Publication Date:
July 15, 2002
Filing Date:
April 13, 1994
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
C08F2/38; C08F22/36; C08F22/40; (IPC1-7): C08F22/40; C08F2/38
Attorney, Agent or Firm:
Hiroshi Nakamoto
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