To provide a resin composition excellent in low thermal expansion, copper foil adhesivity, heat resistance and dielectric property.
A resin composition contains a thermosetting resin obtained by reacting a siloxane resin (a) represented by formula (1), a compound (b) having at least two isocyanate groups in one molecule thereof, and a compound (c) having at least two epoxy groups in one molecule thereof, wherein the siloxane resin (a), the compound (b) and the compound (c) are used in respective proportions of 10 to 50 pts.mass, 40 to 80 pts.mass and 10 to 50 pts.mass with respect to 100 pts.mass of the sum total of the siloxane resin (a), the compound (b) and the compound (c); and the reaction is carried out in an organic solvent so that the reaction rate of the compound (b) becomes 30 to 70 mol%. In the formula, X are each independently selected from the groups of carboxyl, methacryl, glycidyl, alicyclic epoxy and mercapto.
TSUCHIKAWA SHINJI
IZUMI HIROYUKI
| JP2002309084A | 2002-10-23 | |||
| JPH0625504A | 1994-02-01 |
| WO2012018126A1 | 2012-02-09 |
Kenichi Hirasawa