Title:
プリント配線板用樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
Document Type and Number:
Japanese Patent JP7154475
Kind Code:
B2
Abstract:
To provide a resin composition, a prepreg, a metal foil-clad laminate, a resin sheet and a printed wiring board which express balanced physical properties in peel strength, heat resistance and thermal conductivity.SOLUTION: A resin composition for printed wiring boards contains a cyanate compound (A) having a structure represented by the formula (1) with a weight average molecular weight of 340-2000 and a maleimide compound (B) (where, n is an average value of repeating units).SELECTED DRAWING: None
Inventors:
Shota Koga
Kentaro Takano
Kentaro Takano
Application Number:
JP2017065425A
Publication Date:
October 18, 2022
Filing Date:
March 29, 2017
Export Citation:
Assignee:
Mitsubishi Gas Chemical Co., Ltd.
International Classes:
H05K1/03; B32B15/08; B32B27/00; C08F212/34; C08F222/40; C08G73/06; C08J5/24; C08L25/18; C08L35/06; C08L79/04
Domestic Patent References:
| JP1306405A | ||||
| JP2251518A | ||||
| JP2017200966A | ||||
| JP2018168085A |
Foreign References:
| WO2017006891A1 | ||||
| WO2017191771A1 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Kazuhiko Naito
Toshifumi Onuki
Kazuhiko Naito