Title:
光半導体封止用樹脂組成物及び光半導体装置
Document Type and Number:
Japanese Patent JP6492544
Kind Code:
B2
More Like This:
Inventors:
Junko Okada
Rinichi Oda
Rinichi Oda
Application Number:
JP2014223442A
Publication Date:
April 03, 2019
Filing Date:
October 31, 2014
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08L63/00; C08G59/18; C08K3/22; C08K3/36; C08K5/3445; C08L61/06; H01L23/29; H01L23/31
Domestic Patent References:
| JP2005112965A | ||||
| JP2009029926A | ||||
| JP2014162877A | ||||
| JP2008050546A | ||||
| JP2006241353A | ||||
| JP2011171438A | ||||
| JP2013129798A | ||||
| JP2013032442A | ||||
| JP2013224359A |
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office