Title:
トランスファーコンプレッションモールド法用半導体封止用樹脂組成物及び半導体装置
Document Type and Number:
Japanese Patent JP6968001
Kind Code:
B2
Abstract:
To provide a resin composition for semiconductor sealing for transfer compression mold method which is excellent in flowability, is reduced in mold contamination, and can reduce deformation of a wire in sealing when being molded by a transfer compression mold method, and has good filling property of a narrow part, and a semiconductor device which is sealed using the resin composition for semiconductor sealing for transfer compression mold method, has no deformation of a wire and no non-filling part of the narrow part, and has high reliability.SOLUTION: A resin composition for semiconductor sealing for transfer compression mold method contains (A) an epoxy resin, (B) a phenol resin curing agent, (C) a curing accelerator and (D) a spherical inorganic filler.SELECTED DRAWING: None
Inventors:
Tomohisa Utsuno
Takuo Shigama
Takuo Shigama
Application Number:
JP2018035689A
Publication Date:
November 17, 2021
Filing Date:
February 28, 2018
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
C08L63/00; C08G59/40; C08K7/18; H01L23/29; H01L23/31
Domestic Patent References:
| JP2017031371A | ||||
| JP2009235126A | ||||
| JP2003105064A |
Other References:
2012年3月期決算及び中期経営計画(INNOVATION3)について,アピックヤマダ株式会社,2012年05月28日
Attorney, Agent or Firm:
Otani patent office
Kenichi Hirasawa
Arinaga Shun
Hayakawa Miwa
Kenichi Hirasawa
Arinaga Shun
Hayakawa Miwa