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Title:
RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2009051880
Kind Code:
A
Abstract:

To provide a resin composition for sealing a semiconductor having excellent flame retardance and reliability without deteriorating fluidity.

The resin composition comprises an epoxy resin (A), a curing agent (B) and an inorganic filler (C) and is used for sealing the semiconductor. The curing agent contains a phenol resin (B1) containing 3 phenolic hydroxy groups on the average in one molecule and a specific compound (B2). The semiconductor device is obtained by sealing a semiconductor element with a cured product of the resin composition.


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Inventors:
WADA MASAHIRO
Application Number:
JP2007217699A
Publication Date:
March 12, 2009
Filing Date:
August 24, 2007
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08G59/62; C08G59/68; H01L23/29; H01L23/31
Domestic Patent References:
JP2002284965A2002-10-03
JPH065741A1994-01-14
JPH04325516A1992-11-13
JP2003064157A2003-03-05
JP2001098053A2001-04-10
JP2007002110A2007-01-11
JP2006022239A2006-01-26
JP2002348356A2002-12-04
JP2006124643A2006-05-18



 
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