Title:
RESIN COMPOSITION, AND RESIN SHEET, PREPREG, LAMINATE SHEET, METAL SUBSTRATE AND PRINTED WIRING BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP2016138276
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition capable of achieving excellent thermal conductivity and excellent flowability.SOLUTION: A resin composition contains: a first filler which has an average particle diameter (D50) corresponding to cumulative 50% from a small particle diameter side of weight cumulative particle size distribution of 1 nm to 500 nm and contains α-alumina; a second filler which has an average particle diameter (D50) corresponding to cumulative 50% from a small particle diameter side of weight cumulative particle size distribution of 1 μm to 100 μm; and a thermosetting resin having a mesogen group in the molecule.SELECTED DRAWING: None
Inventors:
YOSHIDA YUKA
TAKEZAWA YOSHITAKA
MIYAZAKI YASUO
TAKAHASHI HIROYUKI
TAKEZAWA YOSHITAKA
MIYAZAKI YASUO
TAKAHASHI HIROYUKI
Application Number:
JP2016028805A
Publication Date:
August 04, 2016
Filing Date:
February 18, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L101/02; B32B15/08; C08G59/62; C08J5/24; C08K3/22; C08K3/28; C08K3/38; C08L63/00
Domestic Patent References:
| JP2008213426A | 2008-09-18 | |||
| JP2011012193A | 2011-01-20 | |||
| JP2011090868A | 2011-05-06 | |||
| JP2011208007A | 2011-10-20 | |||
| JP5928477B2 | 2016-06-01 |
Foreign References:
| WO2011040415A1 | 2011-04-07 | |||
| WO2011040416A1 | 2011-04-07 |
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office
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