Title:
樹脂組成物、及び構造体
Document Type and Number:
Japanese Patent JP7427990
Kind Code:
B2
Abstract:
To provide a resin composition having excellent reactivity and quick-curability in a low-temperature environment.SOLUTION: A resin composition has at least one of epoxy resin and phenolic resin and a latent crosslinker, the latent crosslinker comprising an amino phosphine compound with a trivalent P element having an N-P bond, and an organic base.SELECTED DRAWING: None
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Inventors:
Kyohei Nakagi
Seiji Ohashi
Seiji Ohashi
Application Number:
JP2020019892A
Publication Date:
February 06, 2024
Filing Date:
February 07, 2020
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08G59/62; C08G59/50
Domestic Patent References:
| JP2000273147A | ||||
| JP2005232377A |
Attorney, Agent or Firm:
Shinji Hayami
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