Title:
RESIN COMPOSITION FOR TEMPERATURE SENSOR AND ELEMENT FOR TEMPERATURE SENSOR
Document Type and Number:
Japanese Patent JP2021019148
Kind Code:
A
Abstract:
To provide a temperature sensor element that is unlikely to cause hysteresis and overshoot and can accurately identify temperature, and to provide a resin composition for a temperature sensor used for the same.SOLUTION: The resin composition for a temperature sensor includes a polymer containing at least one of an aromatic vinyl structural unit and an aromatic (meth) acrylic acid ester structural unit and a conductive filler.SELECTED DRAWING: None
Inventors:
MACHIDA KATSUICHI
KUZUO TAKUMI
TANNO SEISHI
SHIMIZU KAZUHIKO
ARAKAWA NORIYUKI
KUZUO TAKUMI
TANNO SEISHI
SHIMIZU KAZUHIKO
ARAKAWA NORIYUKI
Application Number:
JP2019135397A
Publication Date:
February 15, 2021
Filing Date:
July 23, 2019
Export Citation:
Assignee:
KUREHA CORP
International Classes:
H01C7/02; C08K3/02; C08L25/04; C08L33/04; G01K7/16; H01C1/142
Attorney, Agent or Firm:
Washeda International Patent Office