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Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2001049126
Kind Code:
A
Abstract:

To obtain a resin composition having improved dispersibility and decreased viscosity and giving a cured product having lowered dielectric constant and improved impact strength by compounding resin particles produced by polymerizing a cycloolefin and having a sphericity falling within a specific range into a resin component.

Resin particles produced by polymerizing a cycloolefin and having a sphericity (average) of 0.90-1.00, preferably 0.95-1.00, more preferably 0.98-1.00 are compounded to a resin component (thermoplastic resin or thermosetting resin, e.g. epoxy resin). The diameter (average) of the above resin particle is preferably ≤1 mm and the resin particle is preferably produced by polymerizing a metathesis polymerizable cycloolefin [e.g. bicyclic or polycyclic norbornenes, ≥4C monocyclic cycloolefin, etc., concretely a norbornene compound such as (substituted) norbornene, dicyclopentadiene and dihydtodicyclopentadiene] in the presence of a metathesis polymerization catalyst.


Inventors:
INOUE YOSHIKI
KAWAI HIROMASA
AOKI TOMOAKI
YAMAZAKI HITOSHI
Application Number:
JP2000063323A
Publication Date:
February 20, 2001
Filing Date:
March 03, 2000
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L101/00; C08G61/08; C08L65/00; (IPC1-7): C08L101/00; C08G61/08; C08L65/00
Attorney, Agent or Firm:
Kunihiko Wakabayashi