Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2017179279
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition having suppressed generation of warpage and suppressed expansion after curing, low in average linear thermal expansion coefficient and elastic modulus, an adhesive film, a circuit board with components, a semiconductor device using the resin composition and a manufacturing method of a sheet-like resin composition.SOLUTION: There is provided a resin composition containing (a) an elastomer, (b1) a liquid epoxy resin having an aromatic structure, (b2) a solid epoxy resin having the aromatic structure and (c) an inorganic filler, the content of (c) component is 50 mass% to 95 mass% based on 100 mass% of a nonvolatile component of the resin composition, elastic modulus at 23°C of a thermal cured article after thermally curing the resin composition at 180°C for 1 hour is 18 GPa or less and moisture permeability coefficient of a thermal cured article is 3 (g/mm/m/24h) or more.SELECTED DRAWING: None
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Inventors:
SAKAUCHI HIROYUKI
OKUBO SHIGEOMI
OKUBO SHIGEOMI
Application Number:
JP2016072699A
Publication Date:
October 05, 2017
Filing Date:
March 31, 2016
Export Citation:
Assignee:
AJINOMOTO KK
International Classes:
C08L63/02; C08K3/00; C08L101/00; H01L23/12; H01L23/14; H01L23/29; H01L23/31; H05K3/00; H05K3/28
Domestic Patent References:
| JP2015199814A | 2015-11-12 | |||
| JP2012052089A | 2012-03-15 | |||
| JP2015134898A | 2015-07-27 | |||
| JP2012025907A | 2012-02-09 |
Foreign References:
| WO2008153208A1 | 2008-12-18 |
Attorney, Agent or Firm:
Sakai International Patent Office