Title:
樹脂組成物
Document Type and Number:
Japanese Patent JP6776577
Kind Code:
B2
Abstract:
The invention provides a resin compound, which has good compatibility and good melt viscosity, and is capable of providing an insulation layer having lower dielectric loss angle tangency and good substrate sealing ability. The resin compound comprises (A) epoxy resin, (B) curing agent, (C) resin having vinyl and (D) indene-coumarone resin. The resin ingredients are set 100 wt%, the proportion of the (D) is 5 wt% to 20 wt%.
Inventors:
Nagashima Masaki
Application Number:
JP2016064640A
Publication Date:
October 28, 2020
Filing Date:
March 28, 2016
Export Citation:
Assignee:
AJINOMOTO CO.,LTD.
International Classes:
C08G59/42; C08L63/00; C08L45/02; C08L71/00; C09J7/35; C09J11/08; C09J145/02; C09J163/00; C09J171/12; H05K1/03; H05K3/46
Domestic Patent References:
| JP2160858A | ||||
| JP5339342A | ||||
| JP2014034580A | ||||
| JP2015004009A | ||||
| JP2000309678A | ||||
| JP2016008240A |
Attorney, Agent or Firm:
Sakai International Patent Office