To provide a resin for encapsulating an optical semiconductor element which can maintain the optical semiconductor element of the encapsulated subject in brightness when it is a light emitting element, and in light receiving sensitivity when it is a light receiving element, respectively higher than conventional resins, and besides can encapsulate easily the optical semiconductor element and is excellent in economy, and to provide an optical semiconductor device having an excellent performance and having the optical semiconductor element encapsulated by using the above resin, and also to provide a high-efficiently manufacturing method for the above device.
The resin for encapsulating an optical semiconductor element comprises a polycarbodiimide expressed by general formula (1), wherein R is a diisocyanate residue [but, at least one R among n Rs is a diisocyanate residue having a skeleton expressed by structural formula (2)]; R1 is a monoisocyanate residue; and n is an integer of 1-100.
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