Title:
電子部品の樹脂封止成形装置
Document Type and Number:
Japanese Patent JP5128095
Kind Code:
B2
Abstract:
In the resin sealing apparatus for electronics parts of the present invention, more than one protrusion formed in the mold cavity penetrates through the more-than-one opening respectively on the heat-dissipation plate mounted in the mold cavity. Thus, the heat-dissipation plate can be positioned with respect to the mold cavity. According to the said method, the heat-dissipation plate can be positioned inside the mold cavity with high precision.
Inventors:
Yuki Okamoto
Application Number:
JP2006228941A
Publication Date:
January 23, 2013
Filing Date:
August 25, 2006
Export Citation:
Assignee:
towa corporation
International Classes:
H01L21/56; H01L23/36
Domestic Patent References:
| JP7045663A | ||||
| JP2001110830A | ||||
| JP2001267345A | ||||
| JP2003197664A |
Previous Patent: JPS5128094
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