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Patent Searching and Data


Title:
樹脂フィルム、積層体及び積層体の製造方法
Document Type and Number:
Japanese Patent JP7226324
Kind Code:
B2
Abstract:
This resin film is characterized by comprising a segment represented by chemical formula 1 and a segment represented by chemical formula 2, and by satisfying condition 1. Condition 1: In an FT-IR spectrum of the resin film, a minimum value (T1) of transmittance at not lower than 3250 cm-1 but lower than 3350 cm-1 and a minimum value (T2) of transmittance at not lower than 3350 cm-1 but lower than 3450 cm-1 satisfy formula 1: T2

Inventors:
Yasuyuki Ishida
Norifumi Miwa
Kensuke Yahiro
Application Number:
JP2019546938A
Publication Date:
February 21, 2023
Filing Date:
August 02, 2019
Export Citation:
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Assignee:
TORAY INDUSTRIES,INC.
International Classes:
C08J5/18; B05D3/06; B05D7/24; B32B27/30; C08F299/06
Domestic Patent References:
JP2014198852A
JP2013184988A
JP2015124265A
JP2012526894A
JP6049154A
JP2019151815A
Foreign References:
WO2008001855A1