Title:
SEMICONDUCTIVE RESIN SHEET AND ITS PRODUCTION METHOD
Document Type and Number:
Japanese Patent JP3721162
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductive resin sheet having stabilized electroconductivity against the change of the environment, and its production method.
SOLUTION: The semiconductive resin sheet is composed of a polymer blend of a polyimide and a polyaniline in a dedoped state, and has an elastic modulus of ≥200 kgf/mm2 and a volume resistivity of 107-1014 Ωcm. Such a semiconductive resin sheet can be obtained by casting a film-forming solution containing a polymic acid and a polyaniline in a dedoped state on to a substrate to form a layer of the above solution on the substrate, heating the layer of the solution to form a resin sheet on the substrate, subsequently peeling the resin sheet from the substrate, and then heating the sheet to imidate the polyamic acid.
Inventors:
Yoshihiro Uetani
Nakamura Masao
Masao Abe
Nakamura Masao
Masao Abe
Application Number:
JP2002363407A
Publication Date:
November 30, 2005
Filing Date:
March 27, 1995
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
C08J5/18; B29C41/12; C08L79/00; C08L79/08; H01B1/20; H01B13/00; B29K79/00; B29L7/00; (IPC1-7): C08J5/18; B29C41/12; C08L79/00; C08L79/08; H01B1/20; H01B13/00
Domestic Patent References:
| JP4063865A | ||||
| JP5262991A | ||||
| JP3138129A | ||||
| JP7090179A | ||||
| JP2500288A | ||||
| JP8259810A |
Attorney, Agent or Firm:
Ichiro Makino
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