Title:
RESIN LAMINATE FOR THERMOFORMING AND METHOD FOR MOLDING THE SAME
Document Type and Number:
Japanese Patent JP2014205294
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin laminate that can be molded into a three-dimensional shape by thermoforming while having a surface protective layer with sufficient scratch resistance.SOLUTION: The resin laminate for thermoforming has a rigid resin layer A produced by curing a three-dimensional crosslinking type curable composition and a thermoplastic resin layer B comprising a thermoplastic resin having a glass transition temperature of less than 200°C. The thickness of the rigid resin layer A is not less than 0.05 mm to less than 0.5 mm. The total thickness of the resin laminate is not less than 0.1 mm to less than 5 mm. The thickness ratio A/B of the rigid resin layer A to the thermoplastic resin layer B is less than 1. At least the outermost surface of the rigid resin layer A is formed by using a three-dimensional crosslinking type curable composition showing a pencil hardness of 7H or more when cured into a sheet form of 0.2 mm in thickness and the outermost surface of the rigid resin layer A shows a pencil hardness of 6H or more when forming a resin laminate including the thermoplastic resin layer B.
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Inventors:
YAMADA HIROAKI
SATO MEGUMI
GOTO SADATOSHI
SATO MEGUMI
GOTO SADATOSHI
Application Number:
JP2013083797A
Publication Date:
October 30, 2014
Filing Date:
April 12, 2013
Export Citation:
Assignee:
NIPPON STEEL & SUMIKIN CHEM CO
International Classes:
B32B27/16; B29C51/14; B32B27/30
Attorney, Agent or Firm:
Kazuya Sasaki
Katsuo Naruse
Tomohiro Nakamura
Sano Eiichi
Katsuo Naruse
Tomohiro Nakamura
Sano Eiichi