RESIN MOLDED PART AND MANUFACTURE THEREOF

Japanese Patent JP3207720

B2

PROBLEM TO BE SOLVED: To reduce the thermal stress of an interface and to prevent the generation of exfoliation and cracks on the interface by a method wherein after an embedding material is laminated in plurality of layers by successively coating the thermosetting resin of different compositions wherein inorganic grains are filled in, casting thermosetting resin is cast.
SOLUTION: After a resin layers 3, having the composition of amorphous silica filling quantity of 80vol.% of 1580phr., is coated on the surface of a vacuum valve 2, a resin layer 4 and a resin layer 5, consisting of different compositions are applied successively on the above-mentioned vacuum valve 2. In the above-mentioned state, the vacuum valve 2 is set in a mold, and a resin layer 7, which is the ordinary casting material, is injected. The resin layers 3, 4 and 5, which are coated at the prescribed temperature, are melted and the interface is eliminated. After hardening, an inclined layer 6, on which the filling quantity of silica powder is changed by stages, is formed on the cast resin A layer from the proximity of the vacuum valve 2. As a result, the thermal stress of the interface is decreased, and the generation of the exfoliation and the cracks on the interface can be prevented.

JPS62193155	SEMICONDUCTOR DEVICE
JP2002305268	CIRCUIT MODULE

Toshio Shimizu
Yasufumi Nagata
Masaru Miyagawa
Kimiya Sato
Miwa Jinno
Yoshihiko Hirano

JP19175895A

September 10, 2001

July 27, 1995

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Toshiba Corporation

H01L23/28; B29C69/02; H01L21/56; H01L23/29; H01L23/31; (IPC1-7): H01L23/29; B29C69/02; H01L21/56; H01L23/31

JP6351647A
JP6262344A
JP5981040U

Hidekazu Miyoshi (3 outside)

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