Title:
樹脂成形装置および樹脂成形品の製造方法
Document Type and Number:
Japanese Patent JP7084226
Kind Code:
B2
Abstract:
A resin molding apparatus (1) includes: a die clamping mechanism (23) configured to vary a distance between a first die and a second die (11, 18); and a controller (100) configured to control the die clamping mechanism. The controller is configured to perform: a process (S116) of measuring a clamping force which is a pressure applied to a molding die by the die clamping mechanism, while decreasing the distance between the first die and the second die in a state where an object to be molded is located in the molding die; a process (S118, S120, S122) of obtaining a first position of the die clamping mechanism at which the measured clamping force exceeds a predetermined first set value; a process (S130) of setting, as a foreign object detection position, a second position obtained by correcting the first position with a correction value; and a process (P1) of detecting a foreign object in the molding die in a molding operation, based on the clamping force measured at the foreign object detection position. Figure 8
Inventors:
Fuyuhiko Ogawa
Keisuke Ogawa
Naohisa Taho
Hisakatsu Shimizu
Keisuke Ogawa
Naohisa Taho
Hisakatsu Shimizu
Application Number:
JP2018117803A
Publication Date:
June 14, 2022
Filing Date:
June 21, 2018
Export Citation:
Assignee:
towa corporation
International Classes:
B29C45/84; B29C33/20; B29C45/02; B29C45/14; H01L21/56
Domestic Patent References:
| JP2005288895A | ||||
| JP3026515A |
Foreign References:
| WO2013014747A1 | ||||
| US5800750 |
Attorney, Agent or Firm:
Fukami patent office
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