Title:
樹脂多層基板および電子機器
Document Type and Number:
Japanese Patent JP7111157
Kind Code:
B2
Abstract:
A resin multilayer substrate includes a stacked body including a first main surface, a cavity provided in the first main surface, and conductor patterns provided in the stacked body. The stacked body includes insulating substrate layers including resin as a main material that are stacked. The cavity includes a side surface and a bottom surface. At least a portion of a boundary between the side surface and the bottom surface includes conductor patterns continuous with the side surface and the bottom surface.
Inventors:
Atsushi Kasuya
Application Number:
JP2020522122A
Publication Date:
August 02, 2022
Filing Date:
May 22, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K1/02; H05K3/46
Domestic Patent References:
| JP2017022227A | ||||
| JP2002171030A | ||||
| JP2016122728A | ||||
| JP2014036188A | ||||
| JP2016035987A |
Attorney, Agent or Firm:
Patent Attorney Kaede International Patent Office
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