To provide a resin opening method capable of roughly uniformly thinning a resin layer and opening a resin with excellent productivity even for the resin of a composition of not easily swelling to a liquid developer, in the resin opening method of forming a resin layer on at least one surface of a base material having an opening, making the resin on the opening thinner than the resin layer on the surface, and thinning the resin layer by an alkaline aqueous solution, thereby removing the resin layer on the opening.
The resin opening method includes, in the order, a step of forming a resin layer on at least one surface of a base material having an opening, a step of making the resin on the opening thinner than the resin layer on the surface, and a step of thinning the resin layer by an alkaline aqueous solution containing an organic alkaline compound.
| JP5138318 | Pin insulator and its manufacturing method |
| JPH0716263 | [Name of device] Sanding device |
TOYODA YUJI
IRISAWA MUNETOSHI
KANEDA YASUO
NAKAGAWA KUNIHIRO
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