Title:
樹脂パッケージ及び発光装置
Document Type and Number:
Japanese Patent JP7248887
Kind Code:
B2
Abstract:
To provide a resin package which improves adhesion between leads and a resin member and a light-emitting device.SOLUTION: A resin package includes a first lead 11 and a second lead 12 and a resin member 14 holding the first lead 11 and the second lead 12, in which the first lead 11 has a first part 11A, a second part 11B, a connection part 11C which is positioned between the first part and the second part, extends in a first direction and connects the first part 11A and the second part 11B, and is narrower than the first part 11A and the second part 11B in a second direction orthogonal to the first direction, and an element mounting region 11a1 arranged on each of the connection part 11C and the first part, in which an upper surface of each of the first part 11A and the second part 11B adjacent to the element mounting region has a recess 11x, and the resin member 14 is arranged in the recess 11x.SELECTED DRAWING: Figure 1A
Inventors:
Takuya Miki
Application Number:
JP2019025099A
Publication Date:
March 30, 2023
Filing Date:
February 15, 2019
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01L33/62; H01L23/02; H01L23/08; H01L23/29; H01L23/31; H01L23/48; H01L33/50; H01L33/52
Domestic Patent References:
| JP2012182215A | ||||
| JP2017183578A | ||||
| JP2014060370A | ||||
| JP2013149866A | ||||
| JP2006086178A | ||||
| JP2002314143A | ||||
| JP2017152629A |
Foreign References:
| US20090045430 |
Attorney, Agent or Firm:
Patent Attorney Corporation Shinju Global IP