Title:
RESIN SEAL MOLD
Document Type and Number:
Japanese Patent JP2023097911
Kind Code:
A
Abstract:
To provide a resin seal mold capable of suppressing manufacturing cost of a resin seal molding.SOLUTION: A resin seal mold resin seals a molding product including a heat sink positioned in a cavity formed between a first mold and a second mold. The first mold has a first cavity block with a cavity surface forming the cavity. A space between the heat sink and the cavity surface becomes narrower during resin sealing of the molding product.SELECTED DRAWING: Figure 1
Inventors:
HISADA TADATSUGU
Application Number:
JP2021214287A
Publication Date:
July 10, 2023
Filing Date:
December 28, 2021
Export Citation:
Assignee:
I PEX CO LTD
International Classes:
H01L21/56
Attorney, Agent or Firm:
Sakai International Patent Office