Title:
RESIN-SEALED SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3544895
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To accurately control the distance between first through-holes for external connection and a sealing resin end by arranging a plurality of second through-holes, all of whose openings are covered with a conductive film on the side of a first region, in a second region excluding the first region, so that a cutting line can be checked surely.
SOLUTION: First through-holes, arranged on an area array on which external connection terminals 4 are mounted, are formed in a wiring board 5, and at the same time, second through-holes 11 are formed also. Thereafter, a conductive film is formed on a surface on which to mount a semiconductor chip 1, and a wiring pattern 6 and a land 7 for external connection are formed. Simultaneously therewith, a conductive pattern 10 is formed in a manner covering the entire surfaces of the openings of the holes 11. The pattern 10 prevents the leakage of a sealing resin 2 from the holes 11 and further facilitates the checking of a cutting line. Furthermore, the chip 1 mounted on the single board 5 is divided into two regions for collective sealing with the resin 2. As a result, productivity can be improved and quality can be stabilized.
Inventors:
Koji Miyata
Application Number:
JP21610899A
Publication Date:
July 21, 2004
Filing Date:
July 30, 1999
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01L23/12; H01L21/56; H01L21/68; H01L23/10; H01L23/31; H01L23/544; (IPC1-7): H01L23/12; H01L21/56
Domestic Patent References:
| JP2000138246A | ||||
| JP2000260793A | ||||
| JP11074296A |
Attorney, Agent or Firm:
Shintaro Nogawa
Takaya Koike
Takaya Koike