Title:
RESIN SEALED TYPE ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2002329816
Kind Code:
A
Abstract:
To provide a resin sealed type electronic component which can solve the problem raised by the conventional electronic parts that, when an electrical failure occurs, the discharge of heat generated by thermal breakage is suppressed by a sealing resin layer and the bursting location of the resin layer is not fixed even when a weak point is formed on a gas discharging case.
In the resin sealed type electronic component constituted by housing at least one electronic component in the case and forming the sealing resin layer in the vacant space of the case, the case and sealing resin layer are partially removed.
Inventors:
MIURA NORIYASU
Application Number:
JP2001131333A
Publication Date:
November 15, 2002
Filing Date:
April 27, 2001
Export Citation:
Assignee:
MARCON ELECTRONICS CO
International Classes:
H01L23/28; H01G4/18; H01L21/56; (IPC1-7): H01L23/28; H01G4/18; H01L21/56
Domestic Patent References:
| JPH1174150A | 1999-03-16 | |||
| JP2000357623A | 2000-12-26 | |||
| JPH0342589A | 1991-02-22 |