To improve the reliability and durability of a surface-mounted component by preventing the peeling of solder from a substrate and a mother board.

The surface-mounted component are provided with a circuit element on the surface 4A of a substrate 4 and a substrate-side electrode 6 which is connected to the circuit element and formed on the rear surface 4B of the substrate 4. The solder 7 composed of a flange section 7A face-joined to the electrode 6, a constricted part 7B extended downward from the flange section 7A, and a semispherical projecting section 7C is attached to the rear surface 4B of the substrate 4. In addition, a resist film 8 is provided on almost the whole rear surface 4B and, at the same time, the flange section 7A is covered with part of the film 8. Consequently, the flange section 7A of the solder 7 can be pressed against the substrate 4 and the joining strength between the solder 7 and substrate-side electrode 6 can be increased.