Title:
RESIN-SEALED TYPE SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH01171259
Kind Code:
A
Abstract:
PURPOSE:To limit the deformation of a bonding wire, and to prevent contacts with a semiconductor chip and an island of the bonding wire by upward bending a lead end in a lead frame. CONSTITUTION:Bent sections 5i, 5j to the bonding wire 4i, 4j sides are formed at each nose of leads 2i, 2j. Even when stress is applied to the bonding wires 4i, 4j from an upper section and the bonding wires are deformed to the island 3 side on a manufacturing process, the bonding wires are sagged deformation is limited at the lead ends 5p, thus generating no short circuit due to the contacts of a semiconductor chip 6 or an island 3 and the bonding wires 4i, 4j.
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Inventors:
SHIDA KOTARO
Application Number:
JP33181587A
Publication Date:
July 06, 1989
Filing Date:
December 25, 1987
Export Citation:
Assignee:
NEC YAMAGATA LTD
International Classes:
H01L23/28; H01L23/50; (IPC1-7): H01L23/28; H01L23/50
Attorney, Agent or Firm:
Uchihara Shin