Title:
RESIN SEALED TYPE SENSOR DEVICE
Document Type and Number:
Japanese Patent JP2015005597
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin sealed type sensor device in which a sensor element that detects inertial force, such as acceleration or angular velocity, is mounted on a pad, and the entire is molded from resin, the resin sealed type sensor device being configured such that inclination or deformation of the sensor element or pad during resin injection is reduced or prevented, thereby suppressing or eliminating sensor output error, and making the resin sealed type sensor device highly reliable.SOLUTION: A resin sealed type sensor device 100 comprises: a sensor element 1 for detecting a physical quantity; a circuit board 2; a pad 3 having rectangular, circular, or oval shape in plane view; a circuit unit 10 formed from suspension leads 5A to 5D connected to the pad 3, and an external power supply lead 4; and a mold resin body 20 sealing the circuit unit 10. In the sensor device 100, when the intersection O of two orthogonal axes L1, L2 is made to coincide with the center point of the shape of the pad 3, the suspension leads 5A to 5D are disposed in corresponding four separate areas into which the shape is temporarily divided.
Inventors:
YAGUCHI AKIHIRO
HAYASHI MASAHIDE
HAYASHI MASAHIDE
Application Number:
JP2013129448A
Publication Date:
January 08, 2015
Filing Date:
June 20, 2013
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD
International Classes:
H01L23/28; G01C19/5783; G01P15/08; G01P15/18; H01L23/50; H01L29/84
Domestic Patent References:
| JP2011044601A | 2011-03-03 | |||
| JP2013062351A | 2013-04-04 | |||
| JP2013044524A | 2013-03-04 | |||
| JP2007048994A | 2007-02-22 | |||
| JP2007066967A | 2007-03-15 | |||
| JP2006229263A | 2006-08-31 |
Foreign References:
| WO2013080238A1 | 2013-06-06 |
Attorney, Agent or Firm:
Yusuke Hiraki
Mitsuo Sekiya
Toshiaki Watanabe
Mitsuo Sekiya
Toshiaki Watanabe