Title:
RESIN SEALING DEVICE
Document Type and Number:
Japanese Patent JP2023106682
Kind Code:
A
Abstract:
To provide a resin sealing device which can remove dust attached on the surface of workpiece and a molding, and can prevent occurrence of a defective product.SOLUTION: A resin sealing device 1 includes a workpiece stocker 102 for storing workpiece W, a workpiece moving part 130 for moving the workpiece W from the workpiece stocker 102 to a workpiece set part 104, a molded article stocker 108 for storing a molded article Wp, and a molded article moving part 132 for moving the molded article Wp to the molded article stocker 108 from a molded article set part 114, and has at least one of a workpiece dust collection part 116 having a first duct part 117 for making suction force act on at least one of the upper surface and the lower surface of the workpiece W during moving by the workpiece moving part 130, and collecting dust, and a molded article dust collection part 118 having a second duct part 119 for making suction force act on at least one of the upper surface and the lower surface of the molded article Wp during moving by the molded article moving part 132, and collecting dust.SELECTED DRAWING: Figure 1
Inventors:
TAGAMI SHUSAKU
YANAGISAWA MAKOTO
YANAGISAWA MAKOTO
Application Number:
JP2022007549A
Publication Date:
August 02, 2023
Filing Date:
January 21, 2022
Export Citation:
Assignee:
APIC YAMADA CORP
International Classes:
H01L21/56; B29C43/34
Attorney, Agent or Firm:
Watanuki International Patent & Trademark Office