To obtain an alkali-developable resist composition having shock and heat resistances and reliability of electrical insulation and excellent in work efficiency by blending a curable composition based on an alkali-soluble acrylic and/or methacrylic [(meth)acrylic] compound with a specified crosslinking elastic polymer and an enhancer which enhances adhesion to copper.
A curable composition based on a (meth)acrylic compound is blended with a carboxyl-containing fine particulate crosslinking elastic polymer and an enhancer which enhaces adhesion to copper to obtain the objective resist composition. The curable composition preferably comprises (1) an alkali- soluble (meth)acrylic compound having a carboxylic group, (2) a polymerizable compound having one or more C=C unsaturated double bonds, (3) a UV polymerization initiator for the polymerizable compound (2), (4) a sensitizer for UV polymerization and (5) a heat polymerization initiator for the polymerizable compound (2), and is a resist composition made to have UV curability.
| JPH10182758A | 1998-07-07 | |||
| JPH09137109A | 1997-05-27 | |||
| JPH0233148A | 1990-02-02 | |||
| JPH02113252A | 1990-04-25 | |||
| JPS61166541A | 1986-07-28 | |||
| JPS5762047A | 1982-04-14 | |||
| JPS57145392A | 1982-09-08 | |||
| JPH11240930A | 1999-09-07 |