To provide a resist pattern forming method in which exposure of a solder resist material can be performed in a short time and laser exposure can be performed using the same solder resist material as a conventional one.
An ultraviolet sensitive solder resist film 7 surface-covered with a cover film 6 is formed on a printed wiring board 3, a resist film 8 which blocks ultraviolet light and is sensitive to visible light is formed above the solder resist film 7, exposed to a resist pattern 11 by exposure with visible light laser 10, and developed with water to form a mask pattern comprising the resist pattern 11 with a hardened film of the resist film 8, and then the solder resist film 7 is exposed to a solder resist pattern 5 with ultraviolet light through the mask pattern as a mask and developed with a weak alkali developing solution to form a solder resist pattern 5 comprising a hardened film of the solder resist film 7 on the printed wiring board 3.
| JPH0259756 | RESIST PATTERN FORMING METHOD |
| JPH0462552 | IMAGE FORMING DEVICE |
SATO KIYOSHI
INOUE EIICHI
| JP2001201870A | 2001-07-27 | |||
| JP2001242618A | 2001-09-07 |
Muranaka