To provide a rotary drum in a film deposition apparatus for an atomic layer chemical vapor deposition, which is capable of depositing a multi-layered film, wherein the size of the entire apparatus can be reduced, and to provide the film deposition apparatus for the atomic layer chemical vapor deposition.

The film deposition apparatus is structured to deposit a film onto an inner surface of a substrate to be treated while winding the substrate around a deposition treatment drum 100 at a prescribed angle and continuously or intermittently transferring the substrate, so that the size of the entire apparatus is reduced. The multi-layered film can be readily deposited by rotating the rotary drum equipped with a film deposition source in the deposition treatment drum.