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Patent Searching and Data


Title:
RUBBER-MOLDING COMPOSITION FOR ELECTRICITY
Document Type and Number:
Japanese Patent JPH06223629
Kind Code:
A
Abstract:
PURPOSE: To provide a novel rubber forming composition for electrical use, particularly provide a composition for matching PST and a PST made from this composition by improving the tearing-off strength of silicon modified EPDM having cold resistance, weather resistance and heat resistance. CONSTITUTION: 100 wt part of silicon modified ethylene-propylene diene terpolymer and particle-like polytetrafluoroethylene and a quantity of 0.5 to 2 wt part of moribdenum disulfide effective for uniformly mixing this particle- like polytetrafluoroethylene in terpolymer are included.

Inventors:
KOBAYASHI HIROYUKI
EINAGA TOMOO
Application Number:
JP56193A
Publication Date:
August 12, 1994
Filing Date:
January 06, 1993
Export Citation:
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Assignee:
MINNESOTA MINING & MFG
International Classes:
C08L19/00; C08K3/30; C08K9/08; C08L21/00; C08L23/16; C08L23/26; H01B3/28; H01B3/30; (IPC1-7): H01B3/28; C08L19/00; C08L23/26; H01B3/30
Attorney, Agent or Firm:
Shoichi Ui (4 others)