Title:
熱硬化性樹脂組成物
Document Type and Number:
Japanese Patent JP4509561
Kind Code:
B2
Abstract:
The present invention relates to a resin composition comprising an at least bifunctional prepolymer (A) curable under the action of heat, a telechelic elastomer and a particulate material having an elastomeric core and a thermoplastic shell. Layers and patterns which are produced using the formulation according to the invention have excellent adhesion properties, chemical stability, good electrical properties and high resistance to rapid temperature ranges. The compositions are suitable in particular as solder resists in the production of circuit boards.
Inventors:
Rovin Pierre-Eri Salvin
Roast, martin
Masato Hoshino
Koji Nojima
Roast, martin
Masato Hoshino
Koji Nojima
Application Number:
JP2003549420A
Publication Date:
July 21, 2010
Filing Date:
November 21, 2002
Export Citation:
Assignee:
HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH
International Classes:
G03F7/032; B32B27/26; C07D301/03; C08F2/00; C08F290/04; C08F290/06; C08F297/02; C08G81/02; C08K3/00; C08K5/00; C08L51/08; C08L53/00; C08L63/00; G03F7/004; G03F7/027; H05K3/28; C08L19/00
Domestic Patent References:
| JP2001188340A |
Attorney, Agent or Firm:
Hajime Tsukuni
Fumio Shinoda
Fumio Shinoda