Title:
低減された温度推移を有するSAW構成素子および製造方法
Document Type and Number:
Japanese Patent JP5243029
Kind Code:
B2
Abstract:
Elements and methods for forming elements that operate with acoustic waves are disclosed. The element includes a piezoelectric substrate that has a first thermal coefficient of expansion, electrically conducting element structures on an upper side of the substrate, a compensation layer on an underside of the substrate, and an SiO2 layer over the element structures.
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Inventors:
Marx Hauser
Ulrich Knauer
Anton Rideul
Aferin Reha
Gertoliha
Ulrike Racer
Werner Ruile
Clemens Ruppel
Gerd Scholl
Ulrich Wolf
Ulrich Knauer
Anton Rideul
Aferin Reha
Gertoliha
Ulrike Racer
Werner Ruile
Clemens Ruppel
Gerd Scholl
Ulrich Wolf
Application Number:
JP2007531626A
Publication Date:
July 24, 2013
Filing Date:
August 18, 2005
Export Citation:
Assignee:
EPCOS AG
International Classes:
H03H9/145; H03H3/10
Domestic Patent References:
| JP2004186868A | ||||
| JP2004242182A | ||||
| JP2002016468A | ||||
| JP2002217672A | ||||
| JP2004222267A | ||||
| JP9208399A |
Foreign References:
| WO2004066493A1 |
Attorney, Agent or Firm:
Takuya Kuno
Kimihiro Hoshi
Hiroyasu Ninomiya
Einzel Felix-Reinhard
Takahashi
Kimihiro Hoshi
Hiroyasu Ninomiya
Einzel Felix-Reinhard
Takahashi