Title:
SAMPLE PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2015153644
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To irradiate the planned processing position of a sample with a beam accurately.SOLUTION: A sample processing device includes a stage having a plurality of electrodes for mounting a sample, and a polarity setting unit for setting the polarity of each electrode of the stage to first or second polarity. Furthermore, the device includes a beam generation source for irradiating a portion of the sample located on the electrode of second polarity with a beam. Furthermore, the device includes a tip recognition unit for recognizing the tip of a sample, and a measurement unit for measuring positional deviation of the tip of a sample recognized by the tip recognition unit and the electrode of second polarity. Furthermore, the device includes a position change unit for changing the relative position of the sample and the beam generation source, based on the positional deviation measured by the measurement unit, and a polarity change unit for changing the polarity of an electrode under the tip of the sample recognized by the tip recognition unit, based on the positional deviation measured by the measurement unit.
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Inventors:
FURUKAWA SHINICHI
Application Number:
JP2014027307A
Publication Date:
August 24, 2015
Filing Date:
February 17, 2014
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01J37/317; G01N1/28; H01J37/20
Attorney, Agent or Firm:
Hirohito Katsunuma
Takeshi Sekine
Akaoka Akira
Jie Yamanoi
Takeshi Sekine
Akaoka Akira
Jie Yamanoi