Title:
SCANNING EXPOSURE METHOD AND MANUFACTURE OF CIRCUIT ELEMENT USING THE METHOD
Document Type and Number:
Japanese Patent JP3513973
Kind Code:
B2
Abstract:
PURPOSE: To improve alignment precision by making the scanning direction when the preceeding scanning exposure is performed by using a first mask pattern coincide with the scanning direction when the subsequent scanning exposure is performed by using a second mask pattern.
CONSTITUTION: A main control system 100 judges whether position measurement of an alignment mark is finished about all designated alignment shot. The main control system 100 calculates shot arrangement coordinates to be exposed, on the basis of measured alignment mark position data. The main control system 100 synchronizes a wafer stage WST with a reticle stage RST to perform scanning, and projects the pattern of a mask R1 on a wafer W. The direction of the preceeding scanning exposure is made the direction of this time. The scanning direction at the time of the preceeding exposure ((m-1)th layer) is made to coincide with the scanning direction at the time of exposure of this time (m-th layer), and scanning exposure is performed.
Inventors:
Umagome, Nobutaka
Application Number:
JP10655795A
Publication Date:
March 31, 2004
Filing Date:
April 28, 1995
Export Citation:
Assignee:
NIKON CORP
International Classes:
G03F9/00; G03F7/20; H01L21/027; (IPC1-7): H01L21/027; G03F9/00