To obtain a sealed flip-chip assembly which is easy to produce, can be reproduced easily and as well as will not breakdown, and is easily reproducible.

A binder which fills a gap in at least one semiconductor device attached by a plurality of solder connections from a support substrate while the gap is being formed in the support substrate, and which can be reworked thermally is constituted in as follows. At least one kind of filler which exists in an amount of 25 to 75 wt.% is contained on the basis of the amount of a cross-linking resin (A) which is prepared by the reaction of at least one kind of a dienophile, comprising one or more functional groups with at least one kind of a polymer containing 2,5-dialkyl-substituted furan and which can be reworked thermally and on the basis of a component (B). As a result, a flip-chip assembly which is sealed with the filler is provided.