SEMICONDUCTOR ELEMENT AND MANUFACTURE THEREOF

Japanese Patent JPH11168154

A

To obtain a BGA and an OMPAC(overmolded pad array carrier) element, which are capable of transmitting and receiving a light signal by a method, wherein an optically active part of a semiconductor component is coated with a light-transmitting material.

A semiconductor element 10 consists of a substrate 11, conductive traces 12 and solder pads 13 which are arranged on the bottom of the substrate, and conductive traces 14 and chip or die mounting pads 17 which are arranged on the upper surface of the substrate 11. The exposed parts of the traces 14 and the pads 17 are covered with a solder mask material layer 22. The layer 22 covers the end parts of conductive vias 19 on the upper surface of the substrate 11. A semiconductor chip 24 has chip bonding pads 26, and these pads are coupled with the traces 14 corresponding to the pads 26 through interconnecting wires 27. The chip 24, the wires 27 and one part of the layer 22 are covered with a light-transmitting material 29, and this material 29 made to harden.

JP2015115557	SEMICONDUCTOR DEVICE MANUFACTURING METHOD
JPH084310	[Name of device] IC card

KNAPP JAMES H
DWIGHT L DANIELS
KEITH E NELSON
BRIAN A WEBB

JP25192298A

June 22, 1999

August 21, 1998

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MOTOROLA INC

H01L23/28; H01L21/60; H01L23/29; H01L23/31; (IPC1-7): H01L23/28; H01L21/60; H01L23/29; H01L23/31

JPH021957A	1990-01-08
JPH03101154A	1991-04-25
JPH07297324A	1995-11-10
JPH0955445A	1997-02-25
JPH0745655A	1995-02-14
JPH08335596A	1996-12-17
JPH08330339A	1996-12-13

Shinsuke Onuki (1 person outside)

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